Semiconductors & T&M Innovation Roundup, September 2025 Highlights
September 2025 reflected a steady stream of breakthroughs across the semiconductor and test & measurement ecosystem. Industry updates covered areas such as analog and mixed-signal testing, next-generation oscilloscopes, advanced optical analyzers, automated circuit validation, and cutting-edge AI innovation labs. Each milestone emphasized the sector’s shift toward higher frequency coverage, smarter automation, and collaborative R&D, while showing how precision instruments and integrated platforms are shaping the future of electronic design and validation.
Date: September 1, 2025
Keywords: Kaynes Semicon, Emerson, NI STS, semiconductor testing
Impacted Products: Analog, mixed-signal, RF, power
Summary: Kaynes Semicon partners with Emerson to adopt the NI STS test platform, boosting chip-test throughput, flexibility, and delivery speed in India.
Source: Bisinfotech – Kaynes Semicon Collaborates with Emerson to Enhance Semiconductor Test Capabilities
Date: September 2, 2025
Keywords: Anritsu, MP1900A, Sequence Editor, PCIe 6.0
Impacted Products: High-speed interface devices (PCIe 6.0, multi-lane interconnects, SERDES, etc.)
Summary: Anritsu has added a GUI-based Sequence Editor to its high-performance BERT device MP1900A, enabling the construction of complex exception/stress test sequences and supporting multi-channel parallel evaluation, facilitating PCIe 6.0 verification processes.
Source: Embedded – Anritsu Adds Advanced Sequence Editor to MP1900A for PCIe 6.0 Validation
Date: September 10, 2025
Keywords: 3D AOI, THT solder joint, pin height measurement
Impacted Products: Through-Hole Technology (THT) printed circuit board assemblies (PCBA) and solder joints
Summary: With the SpectorBOX X1 modular 3D AOI system, MEK brings bottom-side solder joint and pin inspection to THT assemblies, strengthening process control and reliability.
Source: Electropages – MEK Launches SpectorBOX X1 Modular 3D AOI for THT Solder Joints and Pins
Date: September 12, 2025
Keywords: isolation amplifier, current sensing, VIA0050DD
Impacted Products: Power electronics, converters, motor drives
Summary: Vishay introduces the VIA0050DD precision isolation amplifier, offering 5 kVrms isolation and high common-mode transient immunity for accurate current sensing.
Source: Electronics Weekly – Precision Isolation Amplifier for Current Sensing
Date: September 16, 2025
Keywords: Tektronix, 7 Series DPO, oscilloscope, ENOB
Impacted Products: gh-speed signal capture, communications testbenches, RF & microwave measurement systems
Summary: Tektronix unveils the 7 Series DPO oscilloscope, achieving industry-leading low noise and high ENOB performance with a bandwidth up to 25 GHz.
Source: EEJournal – Tektronix Introduces 7 Series DPO, Setting a New benchmark in Ultra-High-Performance Test and Measurement
Date: September 17, 2025
Keywords: optical testing, WaveAnalyzer, WaveShaper, programmable optical filter, spectrum analyzer
Impacted Products: Optical transceivers, wavelength division multiplexing systems, optical networks & test equipment
Summary: Coherent unveils the WaveAnalyzer 200B portable spectrum analyzer and WaveShaper 500B/X programmable filter, enhancing speed, precision, and flexibility in optical network testing.
Source: GlobeNewswire – Coherent Releases Next-Generation Optical Test Tools: WaveAnalyzer & WaveShaper
Date: September17, 2025
Keywords: TCS, Qualcomm, Edge AI, SDx, innovation lab
Impacted Products: Edge AI systems, IoT devices, industrial AI modules, AI inference hardware
Summary: TCS and Qualcomm have established a co-innovation lab in Bengaluru to jointly develop industry-focused Edge AI and Software Defined Everything (SDx) solutions.
Source: Bisinfotech – TCS and Qualcomm Launch Edge AI Innovation Lab
Date: September19, 2025
Keywords: Axon, PoE injector, flight test instrumentation, power injection
Impacted Products: Axon chassis and Pico DAUs (data acquisition units), aerospace flight test systems
Summary: Curtiss-Wright introduces the AXN/PPI/401 module that integrates PoE power injection within the Axon chassis, simplifying flight test instrumentation and enabling sensors to be placed closer to the data acquisition units.
Source: EEJournal – Curtiss-Wright Expands Axon™ Flight Test Instrumentation Family With New Power Injector Module
Date: September19, 2025
Keywords: Siemens, Tessent AnalogTest, analog circuit testing, DFT, test vector generation
Impacted Products: Analog & mixed-signal ICs, analog circuit blocks, semiconductor test workflows
Summary: Siemens' Tessent AnalogTest tool automatically generates test vectors for analog circuits, shortening test development time and improving defect coverage to facilitate IC design verification.
Source: Bisinfotech – Siemens Enhances IC Validation with Tessent AnalogTest Automated Testing
Date: September26 , 2025
Keywords: broadband VNA, calibrated single-sweep, sub-THz testing
Impacted Products: Vector Network Analyzers, Millimeter-wave/sub-THz devices
Summary: Keysight has added a 170/250 GHz frequency extension and calibration kit, enabling broadband single-sweep VNA measurements and enhancing high-frequency device verification capabilities.
Source: All About Circuits – Keysight Pushes VNA Capabilities Up to 250 GHz With Frequency Extenders