November 2025 Advances in Intelligent Testing and Photonic Integration
In November 2025, the semiconductor and test industries advanced lab-integrated automation and intelligent validation. Major developments—including Open RAN conformance platforms, high-power ATE and HIL systems, wafer-scale TFLN photonic breakthroughs, and the MEMS Lab-in-Fab model—accelerated the transition from R&D to scalable manufacturing. Progress in automated testing, photonic integration, and energy-efficient verification highlighted a global move toward higher precision, tighter system integration, and faster technology commercialization.
Date: November 6, 2025
Keywords: IMU, low-g accelerometer, high-g accelerometer
Impacted Products: Industrial IoT sensor nodes, robotic motion controllers, impact/shock detection systems
Summary: The IMU measurement IC integrates both low-g and high-g accelerometers plus a gyroscope to cover fine motion and high-impact events — ideal for industrial IoT, robotics and structural monitoring.
Source: Electronics Weekly — Inertial measurement IC with low and high range accelerometers
Date: November 7, 2025
Keywords: VIAVI, Calnex, Open RAN, 3GPP conformance testing, telecom testbed
Impacted Products: Open RAN radio units (O-RU), distributed units (O-DU), centralized units (O-CU)
Summary: VIAVI and Calnex offer plug-and-play testbeds for Open RAN/3GPP conformance and performance testing, simplifying deployment and certification for operators and vendors.
Source: Bisinfotech — VIAVI and Calnex Simplify Open RAN Conformance and Performance with Comprehensive Pre-Certification Testbeds
Date: November 12, 2025
Keywords: SPARK Microsystems, LE-UWB, presence detection, ultra-low power
Impacted Products: Asset/personnel tracking tags and beacons, Industrial and building automation sensors
Summary: SPARK Microsystems' Presence Detection Kit uses LE-UWB tech to enable ultra-low-power, interference-resistant real-time presence and range detection — ideal for IoT, asset/person tracking, industrial and medical applications.
Source: EEJournal — SPARK Microsystems Unveils Development Kit Harnessing Advanced Presence Detection Capabilities at Ultra-Low Power
Date: November 14, 2025
Keywords: Rohde & Schwarz, Samsung, NR-NTN, 3GPP Release 17, satellite 5G
Impacted Products: NR-NTN chipsets/modules, satellite-enabled 5G devices (terminals, modems)
Summary: Rohde & Schwarz and Samsung successfully validated the first 3GPP-compliant NR-NTN RF, RRM and PCT test cases — laying the conformance groundwork for satellite-based 5G deployment.
Source: Bisinfotech — Rohde & Schwarz Advances 3GPP NR-NTN Testing Progress
Date: November 14, 2025
Keywords: ATE, high-power test, regenerative DC supply, electronic load, power validation
Impacted Products: Power electronics modules, battery systems, EV chargers, industrial power supplies, semiconductor power devices
Summary: The new high-power ATE portfolio (1.5–12 kW) integrates regenerative DC supplies, electronic loads and system power — ideal for automated validation of multi-kilowatt power devices.
Source: Electropages — New high-power ATE test solutions tackle growing power validation challenges
Date: November 18, 2025
Keywords: HIL test system, EV charging, vCTS.performance, 3.84 MW
Impacted Products: Electric vehicle chargers (EVSE), EV onboard charging/DC fast-charging systems
Summary: The vCTS.performance HIL test system delivers up to 3.84 MW DC charging power, designed for EV/EVSE interoperability and durability testing.
Source: Electropages — HIL test system delivers 3.84 MW charging power
Date: November 19, 2025
Keywords: Lab-in-Fab, Fraunhofer ENAS, X-FAB, MEMS, heterogeneous integration
Impacted Products: MEMS sensors, microfluidic devices, photonic integrated circuits
Summary: Fraunhofer ENAS and X-FAB adopt a “Lab-in-Fab” model, merging research and manufacturing to accelerate volume production of MEMS and heterogeneous-integration technologies.
Source: Electronics Weekly — Fraunhofer and X-FAB pioneer lab-in-fab concept
Date: November 25, 2025
Keywords: SAL, thin-film lithium niobate (TFLN), wafer-scale photonics
Impacted Products:
Summary: SAL processed its first 8-inch thin-film lithium niobate (TFLN) wafer in-house, establishing a wafer-scale photonic test and fabrication platform crucial for scalable integrated optics.
Source: Power Electronics News — Wafer-scale vision: SAL's lithium niobate breakthrough accelerates photonic commercialization
Date: November 25, 2025
Keywords: FLIR, Si2 Series, acoustic imaging camera, GPS integration, leak detection
Impacted Products: Acoustic imaging cameras, leak-detection systems, partial-discharge detection tools
Summary: FLIR's Si2 acoustic imaging cameras now include built-in GPS, automatically geotagging inspection images — ideal for large-site inspections, asset maintenance and infrastructure audits.
Source: Electropages — Acoustic Imaging Cameras Now Feature Integrated GPS for Precise, Location-Based Inspections
Date: November 26, 2025
Keywords: SEGGER, in-system programmer, programmable system test, ISP
Impacted Products: Embedded devices, microcontroller-based systems, IoT modules
Summary: SEGGER added programmable system test capabilities to its in-system programmers, streamlining post-programming validation and speeding up system-level testing workflows.
Source: Electronics Weekly — SEGGER adds programmable system test to in-system programmers