Testing Services
Rapid Rabbit offers quality testing solutions for electronic components. Our thorough inspections and advanced verification processes maintain high standards and protect your supply chain from counterfeit parts.
01
External Visual Inspection
A microscope is used for a thorough visual inspection of the component’s exterior and leads/terminations. Key checks include the package surface, marking quality, termination condition, and other critical features to identify surface defects and potential anomalies.
Nondestructively measure the overall part dimensions of body length, width, and thickness.
02
X-ray Radiology
Verify the absence of die cracking, lead frame damage, broken wires or wire bonds, and die tilt.
Determine the consistency of general shape and structure of the package, lead-frame construction, and number and position of wire bonds within the same lot.
03
XRF Testing
Lead Finish Analysis and Material Composition:
Verify RoHS compliance.
Verify material consistency.
Verify the reliability of the original manufacturer’s process.
04
Testing for Remarking/Resurfacing
Testing for Remarking: Determine if a part has been remarked.
Test Solvents: Mineral spirits; Isopropyl alcohol.
Testing for Resurfacing: Determine if a part has been coated, and if so, evaluate the surface under any removed coating for sanding marks, ghost markings, etc.
Test Solvents: 1-Methyl-2-pyrrolidinone; Dynasolve 750.
05
Decapsulation Physical Analysis
Search for the following information on the die surface：
Manufacturer Markings/Name/Logo/Unique Image;
Die Part Numbers, which correlated with manufacturer part number or surface marking;
Year of Design or Tape-out and other information.
06
Electrical Testing (Capacitance/Resistance/Inductance)
Measure basic electrical parameters such as capacitance, resistance, and inductance, and compare the results with the specifications in the manufacturer datasheet to verify consistency.
07
Solderability Testing
All leads shall exhibit a continuous solder coating free from defects for a minimum of 95% of the critical area of any individual lead. For exposed pad packages the exposed pad surfaces shall exhibit a continuous solder coating free from defects for a minimum of 80% of the critical area of those surfaces.
