Dry Packaging
In the production and supply chain management of electronic components, dry packaging is not only a basic quality assurance measure but also a key technology to ensure component reliability in extreme environments. Our laboratory adopts industry-leading high-standard processes and dry packaging technology to ensure every electronic component can be transported and stored safely and stably worldwide.
Our Dry Packaging Testing Process
● Pre-Treatment and Cleaning: Thoroughly clean components using ultrasonic cleaners to remove visible and microscopic dirt, grease, and other contaminants. Dry components in a temperature-controlled hot air circulation oven to ensure any potential moisture is effectively removed.
● Selection and Placement of Desiccants: Choose the most suitable type and amount of desiccants (e.g., silica gel or molecular sieve) based on component sensitivity and package size. Ensure desiccants are evenly distributed inside the package, especially forming a protective ring around the components.
● Vacuum Sealing Process: Cut high-barrier multi-layer anti-static packaging materials to appropriate sizes. Use specialized vacuum sealing machines to quickly and accurately evacuate air from the packaging bag, ensuring excellent sealing effects.
● Humidity Detection and Verification: Place a humidity indicator card in each package to provide visual humidity feedback. Regularly check the internal humidity of the package using high-precision humidity testing equipment to ensure long-term stability.
● Quality Control and Documentation: Record key data such as packaging date, type and amount of desiccants used, humidity indicator results, etc., in detail. Regularly inspect packaged components to verify packaging integrity and desiccant effectiveness.
Our Advanced Equipment
Our laboratory is equipped with advanced dry packaging equipment, capable of precise humidity control and vacuum sealing treatment according to the needs of different types of components. We strictly follow IPC/JEDEC J-STD-033 standards to ensure each component is packaged in the most suitable environment, avoiding performance degradation or damage caused by moisture.
● Ultrasonic Cleaners: Use high-frequency sound waves to create microscopic bubbles in liquid, removing dirt and impurities from component surfaces through bubble explosion effects. Our equipment ensures thorough cleaning of components without damaging the surface, suitable for electronic components of various materials.
● Hot Air Circulation Ovens: Use precisely controlled hot air to evenly heat components for pre-drying. Hot air circulation ovens provide uniform heating with adjustable temperatures, ensuring the temperature does not exceed the thermal sensitivity limits of the components.
● Vacuum Sealing Machines: Use efficient vacuum pump technology to quickly evacuate air from packaging bags, forming highly sealed packaging environments. Our vacuum sealing machines are easy to operate and provide excellent sealing effects, greatly reducing the risk of moisture and contaminant intrusion.
● Humidity Testers: Measure the relative humidity inside the package to evaluate the effectiveness of desiccants and humidity control stability. Our humidity testers provide accurate humidity readings, helping monitor and adjust drying conditions.
Through strict dry packaging testing, our laboratory ensures that each electronic component remains in optimal condition at all stages, whether during storage or global transportation. This professional-grade packaging technology not only enhances the market competitiveness of the tested electronic components but also wins customers' trust and satisfaction. We are committed to continuously optimizing our packaging technology and processes, providing customers with more reliable and safe electronic components.