Decapsulation Physical Analysis

Decapsulation Physical Analysis is performed to conduct a physical-level examination of electronic components following controlled decapsulation, allowing direct observation and assessment of internal structures and key features that are not accessible through non-destructive inspection methods.

Through controlled decapsulation of the component package, internal chips, interconnection structures, and related internal features are exposed. This analysis provides detailed physical observation information at the internal structure level and supports further evaluation of component internal condition.

Decapsulation Physical Analysis is used as a supporting analytical method. The analysis focuses on identifying abnormal structural features or internal characteristics that deviate from expected conditions and does not involve electrical or functional verification.

Analysis Method

During analysis, selected samples are subjected to controlled decapsulation. The decapsulation approach is selected based on the component package type and material characteristics and is performed under controlled conditions to minimize unnecessary impact on internal structures and to preserve observable features as much as practicable.

Following decapsulation, the internal chip and related structures are exposed in a manner suitable for subsequent microscopic examination. Care is taken throughout the process to maintain the integrity of internal features relevant to physical observation.

This analysis does not include any electrical measurements or functional testing.

Internal Structure Examination

After decapsulation, microscopic examination is used to observe the internal structures of the component in detail. Examination focuses on recording physical characteristics and observable features, including but not limited to:

● Appearance, dimensions, and structural characteristics of the internal chip

● Chip surface markings, identifiers, logos, or other recognizable features

● Condition, routing, and attachment characteristics of bond wires, solder joints, or other interconnection structures

● Die attach condition and relative positioning of internal elements

● Presence of abnormal structures, residues, processing marks, or inconsistencies

The purpose of the examination is to obtain objective physical observations and to document internal structural conditions as observed.

Evaluation Considerations

Evaluation is based on the results of microscopic observation and focuses on identifying physical features that may indicate abnormal conditions, including:

● Internal structural layouts that appear inconsistent or atypical

● Chip surface features that deviate from expected appearance

● Interconnection structures exhibiting unusual configuration or condition

●Noticeable differences in internal structure or features among comparable samples

These observations are evaluated as supporting analytical information and are typically reviewed in the context of other inspection and analysis results.

Documentation and Use of Results

All observed conditions are documented and retained as analysis records. Documentation typically includes detailed written descriptions and microscopic image records captured during the examination process to support traceability and reporting.

Results from Decapsulation Physical Analysis are used as supporting analytical information and are commonly reviewed together with external visual inspection, remarking testing, surface reprocessing testing, and other related inspection activities. This analysis does not serve as a standalone basis for determining component authenticity, manufacturing history, compliance status, or acceptability.