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A new evanescence-based heat transfer method boosts thermal efficiency in power electronics, offering breakthroughs in heatsink and semiconductor cooling technology.

Tech and T&M Highlights Apr–May 2025

From April to May 2025, key innovations in test and measurement, electronic reliability, and security screening have emerged. These updates highlight industry efforts to enhance precision, performance, and safety across evolving technologies.


Date: April 1, 2025
Keywords: Security Screening, Millimeter-Wave Imaging, Public Safety
Impacted Products: Security Scanners, Airport Screening Systems
Summary: Garrett Metal Detectors and Rohde & Schwarz have partnered to develop advanced high-security screening solutions using millimeter-wave technology, aiming to enhance detection accuracy in critical infrastructure environments.
Source: BIS Infotech – Garrett & Rohde & Schwarz Partner for High-Security Screening


Date: April 2, 2025
Keywords: Lab Testing, High-Speed Platforms, Data Throughput
Impacted Products: Test Benches, Lab Instruments
Summary: VIAVI has announced upgrades to its One-LabPro test platform, now supporting up to 1.6TB/s throughput, providing improved capabilities for testing complex, high-speed network components.
Source: BIS Infotech – VIAVI Announces Enhancements to One-LabPro 1.6TB/s Test Platform


Date: April 9, 2025
Keywords: Vibration Testing, Electronics QA, Reliability
Impacted Products: PCBs, Electronic Assemblies
Summary: Vibration testing plays a critical role in quality assurance for electronics manufacturing, simulating mechanical stresses that devices may experience throughout their lifecycle.
Source:
 Embedded – How Vibration Testing Underpins Quality Assurance in Electronics Manufacturing


Date: April 11, 2025

Keywords: RF Switch, MEMS, High Power
Impacted Products: Wireless Communication Modules, RF Systems
Summary: Menlo Micro has launched the MM5230, a high-power RF switch capable of handling up to 25W, leveraging MEMS technology to deliver faster switching and lower loss.
Source: Embedded – Menlo Micro Announces Production Launch of MM5230 High-Power RF Switch


Date: April 14, 2025
Keywords: Embedded Systems, Security, Protocol Conformance
Impacted Products: IoT Devices, Embedded Controllers
Summary: Keysight Technologies introduced a next-generation testbench tailored for embedded security, enabling detailed protocol and threat testing across embedded applications.
Source: BIS Infotech – Keysight Introduces Next-Gen Embedded Security Testbench


Date: April 17, 2025
Keywords: Schottky Diode, RF Measurement, Power Devices
Impacted Products: RF Transmitters, Cellular Systems
Summary: A new Schottky diode designed for RF power measurements in cellular systems delivers high speed and low loss, improving test accuracy in communication circuits.
Source: Power Electronics News – A Schottky Diode for Power Measurements in Cellular Phone Systems


Date: April 24, 2025
Keywords: DisplayPort, Compliance Testing, VESA
Impacted Products: Display Interfaces, Video Equipment
Summary: Rohde & Schwarz gained VESA approval for its DisplayPort testing solutions, affirming their compliance accuracy and capability in high-resolution display testing.
Source: BIS Infotech – Rohde & Schwarz Gains VESA Approval for DisplayPort Testing


Date: April 29, 2025
Keywords: Test Platforms, Software Upgrades, NI Connect
Impacted Products: T&M Systems, Industrial Testing Platforms
Summary: Emerson unveiled significant hardware and software enhancements to its test and measurement platforms at NI Connect 2025, improving interoperability and efficiency.
Source: All About Circuits – NI Connect 2025: Emerson Announces Big Hardware, Software Upgrades


Date: April 30, 2025
Keywords: Test Automation, Hardware Innovation, Measurement Systems
Impacted Products: Test Software Platforms, Lab Equipment
Summary: Building on its earlier announcements, Emerson continued showcasing innovations in integrated test systems during NI Connect 2025 with expanded automation features.
Source: All About Circuits – NI Connect 2025: Emerson Announces Big Hardware, Software Upgrades


Date: May 2, 2025
Keywords: Calibration, Thickness Gauges, Precision Measurement
Impacted Products: Thickness Meters, Inspection Tools
Summary: Certified calibration gauges have been introduced for high-accuracy thickness measurements, ensuring traceability and compliance in quality inspection processes.
Source: SMT Today – Certified Calibration Gauges for Precision Thickness Measurement


Date: May 2, 2025
Keywords: AI Testing, Test Automation, Intelligent QA
Impacted Products: Software Platforms, Testing Suites
Summary: Katalon launched TrueTest, an AI-driven testing system aimed at optimizing software quality assurance through intelligent automation and adaptive test case generation.
Source: BIS Infotech – Katalon Unveils TrueTest AI-Powered Testing System


Date: May 7, 2025
Keywords: Hyperscale, Conclave 2025, Cloud Testing
Impacted Products: Data Center Infrastructure, Network Test Equipment
Summary: VIAVI will showcase its hyperscale test solutions during Conclave 2025, highlighting testing innovations for high-volume cloud and data center deployments.
Source: BIS Infotech – VIAVI to Demo Hyperscale Test Solutions at Conclave 2025


Date: May 7, 2025
Keywords: CT Imaging, High Resolution, Industrial X-Ray
Impacted Products: NDT Systems, Research Tools
Summary: Waygate Technologies introduced the Phoenix Nanotom HR, a cutting-edge CT system offering nanometer-level resolution for industry and research applications.
Source: Embedded – Waygate Technologies Unveils Phoenix Nanotom HR


Date: May 8, 2025
Keywords: Test Investment, R&D, Industrial Innovation
Impacted Products: Testing Platforms, Automation Systems
Summary: Emerson has expanded its investment in test and measurement technologies, focusing on accelerating innovation in connected industrial environments.
Source: BIS Infotech – Emerson Increases Test and Measurement Investments


Date: May 8, 2025
Keywords: Wearables, Skin Sensors, Health Monitoring
Impacted Products: Medical Wearables, Flexible Electronics
Summary: IMEC and TNO’s Holst Centre developed an ultra-thin skin-wearable sensor capable of long-term monitoring of bio-signals, marking a breakthrough in personalized health tech.
Source: Semiconductor Today – IMEC, TNO’s Holst Centre Develop Ultra-Sensitive Skin-Wearable Sensor


Date: May 14, 2025
Keywords: O-RAN, Validation, 5G
Impacted Products: Open RAN Devices, Wireless Modules
Summary: VIAVI’s Valor Lab validated the compliance of Metanoia’s O-RU (Open Radio Unit), reinforcing the deployment of open 5G architectures.
Source: BIS Infotech – VIAVI’s Valor Lab Successfully Validates Metanoia’s O-RU


Date: May 20, 2025
Keywords: Counterfeit Parts, Symposium, Component Authentication
Impacted Products: Supply Chain Systems, Electronic Components
Summary: The finalized agenda for the Counterfeit Parts Symposium includes sessions on traceability, standards, and authentication solutions for combating fake components.
Source: SMT Today – Symposium on Counterfeit Parts & Materials Program Finalized


Date: May 20, 2025
Keywords: Joint Venture, EDA, Test Infrastructure
Impacted Products: Semiconductor Test Equipment, IC Validation Systems
Summary: EDA Industries and Chiptest Engineering formed a strategic joint venture to enhance India’s semiconductor testing ecosystem through local development.
Source: Power Electronics News – Strategic Joint Venture Between EDA Industries and Chiptest Engineering


Date: May 22, 2025
Keywords: Flying Probe Tester, PCBA, Automation
Impacted Products: PCBA Testing Systems, Seica Equipment
Summary: 4Front Solutions invested in a Seica Pilot V8 Next flying probe system to enhance testing at its Deland, FL facility, improving fault detection accuracy.
Source: SMT Today – 4Front Solutions Invests in Seica’s Pilot V8 Next Flying Probe Tester


Date: May 26, 2025
Keywords: Heat Transfer, Evanescence, Thermal Interface
Impacted Products: Heatsinks, Semiconductor Cooling Solutions
Summary: A new approach based on evanescence principles has demonstrated significant improvements in solid-surface heat transfer, potentially transforming cooling methods in power electronics.
Source: EE Times – Evanescence Approach Dramatically Improves Solid-Surface Heat Transfer

 

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