Innovation Wave in Semiconductors & T&M August 2025 Highlights
August 2025 witnessed a dynamic wave of innovation across the global semiconductor and test ecosystem, with developments spanning wide bandgap research, new fabrication facilities, integrated test solutions, next-generation memory testing, and breakthroughs in edge AI processing. Each announcement underscored a broader industry momentum toward efficiency, automation, and localized innovation, while highlighting how collaborative partnerships and advanced instrumentation are reshaping the test and measurement (T&M) sector.
Date: August 1, 2025
Keywords: Wide-bandgap semiconductor, SiC, Materials development
Impacted Products: SiC power semiconductors, High-performance power semiconductor devices and processes
Summary: The report notes that onsemi is investing USD 8 million, in partnership with Stony Brook University, to establish a wide-bandgap semiconductor research center equipped with advanced laboratories for materials development, device integration, and performance characterization testing, driving breakthrough progress in SiC devices.
Source: Power Electronics News – Onsemi Fuels SiC Breakthroughs With Strategic University Partnership
Date: August 1, 2025
Keywords: Microfabrication, FabLab, UV lithography
Impacted Products: Semiconductor chips and microdevices
Summary: IIIT Hyderabad establishes a new semiconductor microfabrication lab equipped with key equipment like lithography and etching tools, backed by government and industry support, aiming to cultivate local chip talent and advance India's semiconductor industry.
Source: Bisinfotech – IIIT Hyderabad Opens New Microfabrication and Semiconductor Characterisation FabLab
Date: August 2, 2025
Keywords: Portable test bench, All-in-one tester, WaveForms software
Impacted Products: ADP5470, Integrated test equipment for mixed-signal measurement applications
Summary: Digilent launches its first all-in-one test workbench, Analog Discovery Studio, integrating 7 instrument functions to support educational and professional electronic testing needs.
Source: All About Circuits – Digilent Unveils Its First All-in-One Test Workbench
Date: August 5, 2025
Keywords: Photonic integrated circuit (PIC) testing, AI-driven, autonomous test solution
Impacted Products: Photonic integrated circuits; Intelligent
Summary: Lightium, MPI Corporation, and Axiomatic_AI collaborate to develop the world's first intelligent, autonomous, and integrated test solution (IAITS) for photonic devices, enhancing test automation and precision
Source: bisinfotech – Lightium, MPI Corporation, and Axiomatic_AI Partner on PIC Testing
Date: August 7, 2025
Keywords: HBM3, HBM4E, memory tester, wafer-to-package test
Impacted Products: High-bandwidth memory (HBM) devices—spanning HBM2E through HBM4E
Summary: Teradyne launches the Magnum 7H memory test platform, specifically designed for HBM chips with high speed, precision, and parallelism. It supports multiple HBM standards and boosts mass production testing efficiency by 1.6x.
Source: electropages – Next-Generation Memory Tester for High-Bandwidth Memory Devices
Date: August 12, 2025
Keywords: Edge AI microcontrollers, benchmark results, generative AI
Impacted Products: Ensemble E4, E6, and E8 AI-enabled microcontrollers and fusion processors
Summary: Alif released benchmark results for its new E4, E6, and E8 AI MCUs, underscoring its leadership in the edge AI MCU sector and highlighting their capability to locally execute generative AI workloads.
Source: embedded – Alif Semiconductor Showcases Benchmark Results for E4, E6, and E8 AI-Enabled MCUs, Setting New Standards in Edge Processing
Date: August 15, 2025
Keywords: programmable resistor modules, high-voltage
Impacted Products: high-voltage programmable resistor modules, HIL load simulation modules
Summary: Pickering Interfaces has launched a high-voltage PXI/PXIe plug-in programmable resistor module, supporting up to 1200V. The module features multiple channels and a wide resistance range, enabling simulation of load and fault conditions in high-voltage equipment.
Source: Electronics Weekly – 1200 V PXI or PXIe Programmable Resistors
Date: August 15, 2025
Keywords: NTN OTA testing, satellite link emulation, multi-probe OTA systems
Impacted Products: MVG OTA chambers, Anritsu MT8821C radio communication analyzers
Summary: MVG and Anritsu have introduced a joint 3GPP-compliant NTN OTA testing solution that integrates the MT8821C into MVG’s multi-probe OTA chambers, enabling lab-based emulation of realistic satellite link scenarios for mobile and IoT device validation.
Source: electropages - Partnership to Advance NTN OTA Testing for 3GPP Mobile and IoT Devices
Date: August 18, 2025
Keywords: EMI receiver, real-time gapless scan, 30 MHz–1 GHz, PXE platform
Impacted Products: Keysight PXE EMI receiver (N9048B + N9048BSPU)
Summary: Keysight unveiled an upgraded PXE EMI test receiver capable of a single-step, real-time, gapless scan from 30 MHz to 1 GHz, significantly improving test throughput, sensitivity, and electromagnetic compatibility (EMC) test efficiency.
Source: All About Circuits – Keysight Unveils EMI Test Receiver with Real-Time, 1 GHz Bandwidth
Date: August 25, 2025
Keywords: battery-free sensing, NFC-powered measurement
Impacted Products: Silicon Craft SIC4341 NFC sensor interface IC
Summary: Silicon Craft’s NFC-enabled tag powers and drives a miniature electrochemical measurement system—equipped with an integrated potentiostat and sigma-delta ADC—via a smartphone tap, enabling battery-free testing of nanoamp-scale electrochemical responses.
Source: All About Circuits – Lab on a Tag: NFC Chips Power Medical Sensors—No Batteries Required